With the development of miniaturization of electronic equipment, the space left for module power supply is usually very limited, and even some systems are closed. Therefore, heat dissipation becomes the first issue to be considered. Improving power efficiency and reducing heat loss are related to the stable operation of the power module and the reliable operation of the entire system.

In the fields of railway, medical treatment, military industry, etc., the demand is increasing, because it involves public transportation, personal safety and other issues, the first consideration is the high reliability of the module, work safety and other requirements. The power module must be able to work normally for a long time under severe vibration or harsh environment, and no errors are allowed. This is a challenge to the technical development and production process of domestic power module manufacturers, and both development and production lines must be very reliable.

Sequencing and tracking of power supplies, designers have traditionally built separate on-board circuits to handle voltage sequencing, using many components and taking up a lot of space. Now some power supply manufacturers have integrated this technology in chips or modules to make it easier for system designers to complete the design.

With the continuous advancement of semiconductor process technology, the chips and components on the PCB board have higher functions, faster running speeds, and smaller volumes, driving power management ICs to provide lower and more accurate voltages, larger currents, and stricter requirements. Voltage feedback accuracy, higher efficiency performance. On the other hand, the application field of power management ICs continues to expand and deepen, achieving better control functions, smarter control loops, faster dynamic response characteristics, and simpler peripheral layout design. Therefore, simplifying the design, digitization, modularization, and intelligent power IC is an inevitable development trend.